At LeeMAH, your electronics manufacturing challenges are our own!

Printed Circuit Board (PCBA) Assembly Highlights

General Capabilities Surface Mount Technology
Pin Thru-Hole
Ball Grid Array
Functional, Flying Probe, Boundary Scan and In-Circuit Testing
Burn-In
Conformal Coating
RTV Encapsulation
Flexible Circuit
Equipment Automated Screen Printing
AOI – Automated Optical Inspection
Convection Reflow Oven
General Products Lead Forming
Juki Pick and Place Equipment
Wave Soldering (RoHS and Lead)
In-Line and Batch Washers
Ionic Contamination Tester
2D X-Ray
RoHS XRF Analyzer
Metcal Solder Stations
Agilent 3070 ICT
Acculogic Flying Probe
Thermotron Environmental Chamber
Desiccant Chambers
Dispatch Ovens
Automated Board Handlers
De-Paneling Equipment
Printed Circuit Board Assembly Ball Grid Array
Clean and No Clean Flux Systems
Rigid, Flexible and Rigid / Flexible
Single & Double-Sided
Placement down to 01005
Package Sizes
  • FBGA
  • LGA
  • QFN
Metal Core Insulated
Mixed Technology (SMT and Thru Hole)
RoHS and Leaded Process
Assembly Methods Automated Assembly
Hand Insertion
Hand Soldering
Reflow
Wave Solder
Additional Services Provided Conformal Coating
Repair & Refurbishment
Length Min 2”
Max 18"
Width Min 2”
Max 18"
Thickness Min .031”
Max .125"
Lead Time (Manufacturing) Standard 2 weeks
Production Volume Low Volume to High Volume
Prototype

Additional Information

Industry Focus Communications
Industrial
Instrumentation
Medical Devices
Military / Aerospace
Transportation
Professional Audio
Industry Standards AS9100D/ISO-9001:2015 Certification
NIST Standards
MIL-STD-45662 IPC 610 Class II & III standards
RoHS compliant
ITAR Registered
FDB Device License
NCSDC Certification
File Formats AutoCAD(DWG)
DXF - Drawing Exchange Format
Microsoft Excel
GIF - Graphics Interchange Format
JPEG - Joint Photographic Experts Group
PDF - Portable Document Format
TIFF - Tagged Image File Format
SolidWorks
Gerber
ODB++
CADASCII